Infineon FS50R12KT3 IGBT Module: Datasheet, Pinout, and Application Circuit Design Guide
The Infineon FS50R12KT3 is a prominent 50A, 1200V IGBT module designed for high-power switching applications. This module integrates advanced IGBT and diode technologies, offering a robust solution for demanding industrial environments. It is widely used in motor drives, renewable energy systems, industrial inverters, and UPS applications due to its high efficiency, low saturation voltage, and excellent thermal performance.
Datasheet Overview
Key specifications from the datasheet highlight the module’s capabilities:
- Voltage Rating: 1200V collector-emitter voltage (V_CES).
- Current Rating: 50A nominal collector current (I_C) at 80°C.
- Switching Frequency: Optimized for operation up to 20 kHz.
- Saturation Voltage: Low V_CE(sat) of 2.05V (typical), reducing conduction losses.
- Thermal Resistance: Low junction-to-case thermal resistance (R_th(j-c)) of 0.25 K/W for efficient heat dissipation.
- Isolation Voltage: 2500V (UL certified), ensuring safety and reliability in high-voltage systems.
Pinout Configuration
The FS50R12KT3 follows a standard half-bridge configuration with multiple terminals for power and control:
- Main Terminals: Collector (C1, C2), Emitter (E1, E2) for the IGBTs; Anode (A), Cathode (K) for the anti-parallel diodes.
- Gate Drivers: Gate emitter (G1, E1) and (G2, E2) for controlling each IGBT switch.
- Auxiliary Pins: Includes temperature sensor (NTC) pins for thermal monitoring.
Proper connection is critical; refer to the datasheet for the pinout diagram to avoid miswiring.

Application Circuit Design Guide
Designing with the FS50R12KT3 requires attention to gate driving, thermal management, and protection:
1. Gate Driver Circuit: Use a dedicated gate driver IC (e.g., Infineon EiceDRIVER™) to provide sufficient drive voltage (typically +15V/-8V). Include series gate resistors (e.g., 2.2-10Ω) to control switching speed and suppress oscillations.
2. Snubber Circuits: Implement RC snubbers across IGBTs to reduce voltage spikes during switching, especially in inductive load conditions.
3. Thermal Design: Mount the module on a heatsink with low thermal impedance. Use thermal paste to minimize junction temperature. Monitor temperature via the built-in NTC for overtemperature protection.
4. Protection Features: Incorporate desaturation detection, short-circuit protection, and soft-turn-off to safeguard against overcurrent conditions.
5. DC-Link Capacitors: Place low-inductance capacitors close to the module to minimize parasitic inductance and suppress bus voltage fluctuations.
Example Half-Bridge Inverter Circuit
A typical application involves a half-bridge inverter for motor drives:
- Connect DC-link capacitors (e.g., 470μF/1200V) between the positive and negative busbars.
- Drive the IGBTs with complementary PWM signals from a microcontroller via isolated gate drivers.
- Use shunt resistors for current sensing and optocouplers for isolation.
- Integrate a filter network at the output to reduce EMI.
Conclusion
The Infineon FS50R12KT3 is a versatile IGBT module that balances performance and reliability. By adhering to proper design practices—including robust gate driving, effective cooling, and comprehensive protection—engineers can leverage its full potential in high-power systems.
ICGOO FIND: The Infineon FS50R12KT3 stands out for its high power density and reliability, making it ideal for industrial inverters and energy conversion systems. Its integrated design simplifies assembly while ensuring durability under stressful operating conditions.
Keywords: IGBT Module, Gate Driver Design, Thermal Management, Half-Bridge Inverter, Protection Circuits.
